Product Description

Applications:

Tungsten Carbide, Sinter Metal, Hard Metal, Bronze, Aluminum, Quartz, Crystal, Sapphire, Optical Glass, MLCC, Ceramic Substrate, Zirconium, Engineering Plastics, Composite, NTC Substrate, PZT Substrate, Diamond dicing Blade, Ferrite, Silicon, Silicon Carbide, etc

Features

Double side Grinding Machine (Model: DSG Series)

*-High rigidity & high sealing ensure no vibration- Accuracy

*-Digital size controller Longer machining Accuracy

*- Upper and lower wheels are driven by independent geared motors. Inner ring is driven by AC Servo motor without any maintenance.

*-User friendly Touch Screen- Simple operation

*-Suit for fine Grinding, Lapping and Polishing etc

*-Pre, main and post load position can be controlled by simple setting.

*-Operator gets more space for loading from upper wheel Swivel device. It can be equiped with semi or full automatic Loading or Unloading device.